“# Memory Semis Monthly October '26 Edition: Is the Wall of Worry justified? ## CXMT's possible 4F2 ramp not a concern for industry supply According to the press (link), CXMT's President indicated "launching" 4F2 Vertical Channel Access Transistor (VCAT) DRAM before year end; it i…”
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# Memory Semis Monthly October '26 Edition: Is the Wall of Worry justified? ## CXMT's possible 4F2 ramp not a concern for industry supply According to the press (link), CXMT's President indicated "launching" 4F2 Vertical Channel Access Transistor (VCAT) DRAM before year end; it is unclear what "launching" means, but we suspect R&D or sample as 6F2 G5 (1a nm) manufacturing ramps in 2027. As we wrote before (link; link), 4F2 VCAT allows to increase density (all things being equal) by $50\%$ vs. 6F2 whilst not changing the lithography half pitch; or less if relaxing it. Ultimately though, subsequent process nodes will need lower half pitch and more advanced litho. VCAT also has its own sets of challenges around deposition (ALD) and selective epi in particular. We note that Samsung is likely targeting 4F2 VCAT for 0a nm by late-2028, after 1d nm 6F2 ramp in 2027. Lastly, moving on a distinct path for DRAM process tech usually requires at least 3 process nodes iterations to maximize efficiency and performance. This may mean a later than otherwise move to 3D DRAM, which would, ultimately, remove the need for EUV litho for DRAM manufacturing. This, to us, would be the more material fork in the road. ## HBM de-specing may continue amidst stronger server DDR/SSD demand Our checks indicate that DRAM makers continue to see upsized orders into 2027 for server DDR5, boosted by agentic AI inferencing deployment. In addition, we believe that SOCAMM orders from Nvidia (for Vera CPUs) have gotten stronger over the past 2 months, now exceeding 50bn Gb in 2027. This is larger than total PC+GDDR DRAM bit consumption. This, in turn, has pressured down HBM shipments, which we estimate would likely only grow 49% YoY. Hence, HBM de-specing was largely unavoidable. We continue to expect Nvidia VR300 to adopt HBM4 8-Hi (then HBM4E). Feynman may adopt HBM4E 8 or 12-Hi, as well as TPU v9. Some inference-centric ASICs may be at 4-Hi. One consequence of HBM density de-specing for VR300 is an increase in demand for NAND (KV Cache; CMX for Nvidia), which our checks indicate has recently picked up. ## Samsung may accelerate the cadence of capacity ramp further We recently increased, again, our capex forecasts for Samsung (link). We expect Samsung to add 120k wpm of DRAM capacity 4Q26>4Q27 from 700k wpm to 820k wpm. This is on the back of P4 finishing its ramp and P5-1 starting to get equipment in July 2027. After this, in 2028, it is possible that Samsung would aim to start ramping up one clean room in P5-1 whilst the precedent one is still getting in equipment, and/or debottleneck P2/P3. This could allow Samsung to add >150k wpm in DRAM capacity in 2028, even assuming some NAND capacity addition in P5. This may not materially impact supply / demand before late 2028. ## Correction in memory stocks may present an attractive opportunity Memory stocks are now down 19% from the more recent peak in September, almost back to the July trough. We think this should push memory companies to get going on shareholder returns. At current average '27-30E FCF yields for our coverage (ex-CXMT) of 29%, we remain positive on the group. Our top pick remains Key Call Buy Samsung Electronics, whilst we maintain Buy ratings on all stocks in our coverage universe. ## Equities Global Semiconductors Nicolas Gaudois Analyst nicolas.gaudois@ubs.com +65-6495 5148 Kenji Yasui Analyst kenji.yasui@ubs.com +81-3-5208 6211 Jimmy Yu Analyst S1460517080002 jimmy.yu@ubs.com +86-21-3866 8880 Jimmy Yoon Analyst jimmy.yoon@ubs.com +65-6495 4617 Luke Yoo Analyst luke.yoo@ubs.com +82-2-3702 8132 Atsuhiro Kinoshita Analyst atsuhiro.kinoshita@ubs.com +81-3-5208 6768 Sunny Lin Analyst sunny.lin@ubs.com +886-2-8722 7346 Francois-Xavier Bouvignies Analyst francois.bouvignies@ubs.com +44-20-7568 7105 Randy Abrams Analyst randy.abrams@ubs.com +886-2-8722 7338 ## KEY CHARTS Figure 1: AI server GPU/accelerator unit forecasts ('000 units) HBM Gen. HBM Content (GB) 2025 1Q26 2Q26 3Q26E 4Q26E 2026E 1Q27E 2Q27E 3Q27E 4Q27E 2027E NVIDIA 2025E 2026E 2027E L40S GDDR6 48 38 H200 HBM3E 141 593 H20 / H20E HBM3 / 3E 96 441 B200 (8Hi) HBM3E 192 1,441 GB200 (2x GPU - 8Hi) HBM3E 384 384 1,080 103 103 B300 (12Hi) HBM3E 288 288 288 587 267 300 200 100 867 50 50 GB300 (2x GPU - 12Hi) HBM3E 576 576 576 778 658 670 580 450 2,358 360 270 180 90 900 R200 (12Hi) HBM4 288 288 20 200 320 540 360 400 320 240 1,320 RV200 (2x GPU - 12Hi) HBM4 576 576 40 250 450 740 600 720 690 630 2,640 R300 (8Hi) HBM4 192 250 250 R300 (8Hi) HBM4E 256 400 400 RV300 (2x GPU - 8Hi) HBM4 384 250 250 RV300 (2x GPU - 8Hi) HBM4E 512 550 550 *Other GPU/Accel HBM3 / 3E 288 384 576 107 60 80 80 80 300 70 70 80 80 300 Total Units 5,066 1,088 1,110 1,310 1,400 4,908 1,440 1,460 1,770 1,990 6,660 % YoY 3% -17% 0% 3% 3% -3% 32% 32% 35% 42% 36% % QoQ -20% 2% 18% 7% 3% 1% 21% 12% Total SiPs 6,924 1,849 1,820 2,140 2,300 8,109 2,400 2,450 2,890 3,260 11,000 % YoY 38% 27% 23% 15% 8% 17% 30% 35% 35% 42% 36% % QoQ -13% -2% 18% 7% 4% 2% 18% 13% AMD MI300 HBM3 192 71 MI325X (12Hi) HBM3E 256 256 224 18 18 MI355X (12Hi) HBM3E 288 288 221 170 150 80 70 470 MI308X HBM3 192 192 96 29 28 5 62 MI450 (12Hi) HBM4 432 432 45 230 275 350 450 470 380 1,650 MI5XX (16Hi) HBM4E 1024 60 160 220 *Other GPU/Accel HBM3 192 192 288 4 1 1 1 1 6 2 2 2 2 8 Total Units 616 218 179 131 301 831 352 452 532 542 1,878 % YoY 41% 81% 86% -26% 37% 35% 61% 152% 305% 80% 126% % QoQ -1% -18% -27% 129% 17% 28% 18% 2% Google TPU v5e HBM2E 32 134 TPU v5p HBM2E 96 1,916 TPU v6e HBM3E 32 32 426 205 224 141 70 640 TPU v7 HBM3E 192 192 192 90 520 720 800 750 2,790 600 450 300 150 1,500 TPU v8i (Dual die AX) HBM3E 288 288 25 225 250 700 1,000 1,300 1,000 4,000 TPU v8t (Single die X) HBM3E 216 216 70 380 450 700 1,200 1,500 1,000 4,400 *Other TPU/Accel HBM3 96 144 144 77 7 9 10 10 37 25 25 25 25 100 Total Units 2,643 732 953 1,046 1,435 4,167 2,025 2,675 3,125 2,175 10,000 % YoY 19% 14% 66% 82% 68% 58% 177% 181% 199% 52% 140% % QoQ -14% 30% 10% 37% 41% 32% 17% -30% Amazon Inferentia 2 HBM2E 32 88 Trainium 2 / 2.5 HBM3E 96 144 144 496 130 220 140 100 590 50 10 60 Inferentia 3 HBM3 96 96 96 162 30 28 20 18 96 15 10 25 Trainium 3 HBM3E 144 144 320 620 840 1,780 840 780 640 540 2,800 Trainium 4 HBM4 256 40 240 280 *Other Accel HBM3 144 144 144 37 5 6 8 10 28 8 8 7 7 30 Total Units 783 165 574 788 968 2,494 913 808 687 787 3,195 % YoY -8% -17% 180% 302% 424% 218% 454% 41% -13% -19% 28% % QoQ -11% 248% 37% 23% -6% -12% -15% 15% Intel / Habana Gaudi 3 HBM2 / 3E 288 288 188 30 18 8 56 Gaudi 4 HBM3E 288 288 10 25 35 25 20 15 10 70 *Others HBM2 / 3E 192 192 192 25 6 4 4 5 18 4 4 4 4 16 Total Units 213 36 22 22 30 109 29 24 19 14 86 % YoY -32% -20% -60% -63% -46% -49% -19% 11% -12% -53% -21% % QoQ -36% -40% 0% 39% -3% -17% -21% -26% Microsoft Maia 100 HBM3 120 120 34 3 1 4 Maia 200 HBM3E 288 288 2 6 10 14 33 14 10 7 4 35 Maia 300 HBM4 288 8 14 22 *Others HBM3 120 192 192 8 2 2 2 2 8 2 2 2 2 8 Total Units 42 7 9 12 16 45 16 12 17 20 65 % YoY 22% -27% -19% 4% 84% 7% 119% 35% 36% 24% 45% % QoQ -17% 22% 40% 29% 0% -25% 42% 18% Meta MTIA v1 LPDDR5 64 64 421 20 5 25 MTIA v2 LPDDR5 128 128 30 20 8 2 30 MTIA v3 HBM3E 192 192 192 5 15 20 35 40 110 40 30 20 15 105 MTIA v4 HBM4 432 40 80 100 120 340 *Others LPDDR5 64 128 128 28 3 1 1 1 6 5 5 5 5 20 Total Units 484 58 34 38 41 171 85 115 125 140 465 % YoY 19% -43% -71% -71% -68% -65% 47% 235% 228% 240% 171% % QoQ -56% -41% 11% 8% 106% 35% 9% 12% Tesla Dojo HBM3 64 64 64 62 17 18 15 14 64 15 15 18 15 63 *Others HBM3 64 64 64 44 7 7 6 6 26 6 6 5 5 22 Total Units 106 24 25 21 20 90 21 21 23 20 85 % YoY -39% -12% -9% -24% -16% -15% -12% -17% 10% 2% -5% % QoQ 2% 6% -17% -7% 7% 0% 10% -13% Others Startups HBM3 192 288 288 657 150 150 155 155 610 170 180 185 190 725 Others HBM2E /3 192 288 288 361 30 30 39 39 138 60 63 65 67 254 Total Units 1,019 180 180 194 194 748 230 243 250 257 979 % YoY 59% -28% -32% -26% -20% -27% 28% 35% 29% 32% 31% % QoQ -26% 0% 8% 0% 18% 6% 3% 3% Source: Company data, UBS estimates Figure 2: HBM demand forecasts by GPU/accelerator HBM Gen. HBM Content (GB) 2025 1Q26 2Q26 3Q26E 4Q26E 2026E 1Q27E 2Q27E 3Q27E 4Q27E 2027E NVIDIA 2025E 2026E 2027E H200 HBM3E 141 83,571 H20 / H20E HBM3 / 3E 96 42,336 B200 (8Hi) HBM3E 192 276,649 GB200 (2x GPU - 8Hi) HBM3E 384 384 414,872 39,504 39,504 B300A (12Hi) HBM3E 144 144 0 0 0 0 0 0 B300 (12Hi) HBM3E 288 288 288 169,176 76,896 86,400 57,600 28,800 249,696 14,400 14,400 GB300 (2x GPU - 12Hi) HBM3E 576 576 576 448,259 379,008 385,920 334,080 259,200 1,358,208 207,360 155,520 103,680 51,840 518,400 R200 (12Hi) HBM4 288 288 5,760 57,600 92,160 155,520 103,680 115,200 92,160 69,120 380,160 RV200 (2x GPU - 12Hi) HBM4 576 576 23,040 144,000 259,200 426,240 345,600 414,720 397,440 362,880 1,520,640 R300 (12Hi) HBM4 192 48,000 48,000 R300 (12Hi) HBM4E 256 102,400 102,400 RV300 (4x GPU - 12Hi) HBM4 384 96,000 96,000 RV300 (4x GPU - 12Hi) HBM4E 512 281,600 281,600 *Other GPU/Accel HBM3 / 3E 288 384 576 30,787 23,040 30,720 30,720 30,720 115,200 40,320 40,320 46,080 46,080 172,800 Total ('000 GB) 1,465,650 518,448 531,840 624,000 670,080 2,344,368 711,360 725,760 783,360 913,920 3,134,400 Total (bn Gb) 11.73 4.15 4.25 4.99 5.36 18.75 5.69 5.81 6.27 7.31 25.08 AMD MI300 HBM3 192 13,685 MI325X (12Hi) HBM3E 256 256 57,294 4,608 4,608 MI355X (12Hi) HBM3E 288 288 63,569 48,960 43,200 23,040 20,160 135,360 MI308X HBM3 192 192 18,394 5,568 5,376 960 11,904 MI450 (12Hi) HBM4 432 432 19,440 99,360 118,800 151,200 194,400 203,040 164,160 712,800 MI5XX (16Hi) HBM4E 1,024 61,440 163,840 225,280 *Other GPU/Accel HBM3 192 192 288 812 274 285 282 281 1,123 576 576 576 576 2,304 Total ('000 GB) 153,754 59,410 48,861 43,722 119,801 271,795 151,776 194,976 265,056 328,576 940,384 Total (bn Gb) 1.23 0.48 0.39 0.35 0.96 2.17 1.21 1.56 2.12 2.63 7.52 Google TPU v5e HBM2E 32 4,282 TPU v5p HBM2E 96 183,913 TPU v6e HBM3E 32 32 13,632 6,554 7,168 4,506 2,253 20,480 TPU v7 HBM3E 192 192 192 17,280 99,840 138,240 153,600 144,000 535,680 115,200 86,400 57,600 28,800 288,000 TPU v8i (Dual die AX) HBM3E 288 288 7,200 64,800 72,000 201,600 288,000 374,400 288,000 1,152,000 TPU v8t (Single die X) HBM3E 216 216 15,120 82,080 97,200 151,200 259,200 324,000 216,000 950,400 *Other TPU/Accel HBM3 96 144 144 7,389 1,044 1,359 1,492 1,440 5,335 3,600 3,600 3,600 3,600 14,400 Total ('000 GB) 226,495 107,437 146,767 181,917 294,573 730,695 471,600 637,200 759,600 536,400 2,404,800 Total (bn Gb) 1.81 0.86 1.17 1.46 2.36 5.85 3.77 5.10 6.08 4.29 19.24 Amazon Inferentia 2 HBM2E 32 2,823 Trainium 2 / 2.5 HBM3E 96 144 144 47,574 18,720 31,680 20,160 14,400 84,960 7,200 1,440 8,640 Inferentia 3 HBM3 96 96 96 15,563 2,880 2,688 1,920 1,728 9,216 1,440 960 2,400 Trainium 3 HBM3E 144 144 46,080 89,280 120,960 256,320 120,960 112,320 92,160 77,760 403,200 Trainium 4 HBM4 256 10,240 61,440 71,680 *Other Accel HBM3 144 144 144 5,375 691 818 1,123 1,380 4,012 1,152 1,152 1,008 1,008 4,320 Total ('000 GB) 71,336 22,291 81,266 112,483 138,468 354,508 130,752 115,872 103,408 140,208 490,240 Total (bn Gb) 0.57 0.18 0.65 0.90 1.11 2.84 1.05 0.93 0.83 1.12 3.92 Intel Gaudi 3 HBM2 / 3E 288 288 54,212 8,640 5,184 2,304 16,128 Gaudi 4 HBM3E 288 288 2,880 7,200 10,080 7,200 5,760 4,320 2,880 20,160 *Others HBM2 / 3E 192 192 192 4,789 1,152 691 691 960 3,494 768 768 768 768 3,072 Total ('000 GB) 59,001 9,792 5,875 5,875 8,160 29,702 7,968 6,528 5,088 3,648 23,232 Total (bn Gb) 0.47 0.08 0.05 0.05 0.07 0.24 0.06 0.05 0.04 0.03 0.19 Microsoft Maia 100 HBM3 120 120 4,050 360 120 480 Maia 200 HBM3E 288 288 660 1,696 3,016 4,052 9,424 4,032 2,880 2,016 1,152 10,080 Maia 300 HBM4 288 2,304 4,032 6,336 *Others HBM3 120 192 192 960 384 384 384 384 1,536 384 384 384 384 1,536 Total ('000 GB) 5,010 1,404 2,200 3,400 4,436 11,440 4,416 3,264 4,704 5,568 17,952 Total (bn Gb) 0.04 0.01 0.02 0.03 0.04 0.09 0.04 0.03 0.04 0.04 0.14 Meta MTIA v3 HBM3E 192 192 192 960 2,880 3,840 6,720 7,680 21,120 7,680 5,760 3,840 2,880 20,160 MTIA v4 HBM4 432 17,280 34,560 43,200 51,840 146,880 Total ('000 GB) 960 2,880 3,840 6,720 7,680 21,120 24,960 40,320 47,040 54,720 167,040 Total (bn Gb) 0.01 0.02 0.03 0.05 0.06 0.17 0.20 0.32 0.38 0.44 1.34 Others Tesla HBM3 64 64 6,780 1,523 1,613 1,344 1,255 5,735 1,344 1,344 1,472 1,280 5,440 Startups / Etc. HBM2E / 3 192 288 195,559 51,840 51,840 55,800 55,800 215,280 66,096 69,984 71,928 73,872 281,880 Total ('000 GB) 202,339 53,363 53,453 57,144 57,055 221,015 67,440 71,328 73,400 75,152 287,320 Total (bn Gb) 1.62 0.43 0.43 0.46 0.46 1.77 0.54 0.57 0.59 0.60 2.30 Total HBM Demand ('000 GB) 2,184,545 775,025 874,103 1,039,582 1,332,654 4,021,364 1,604,832 1,831,968 2,098,536 2,154,672 7,690,008 Total HBM Demand (bn Gb) 17.48 6.20 6.99 8.32 10.66 32.17 12.84 14.66 16.79 17.24 61.52 % YoY 103% 97% 103% 72% 77% 84% 107% 110% 102% 62% 91% % QoQ 3% 13% 19% 28% 20% 14% 15% 3% Source: Company data, UBS estimates Figure 3: HBM vendors' bit shipments (M 1Gb) 2025 Q126 Q226 Q326E Q426E 2026E Q127E Q227E Q327E Q427E 2027E SK Hynix 12,628 3,803 3,804 4,559 5,273 17,438 4,611 4,812 5,058 5,587 20,068 % YoY 86% 31% 20% 41% 59% 38% 21% 26% 11% 6% 15% % QoQ 15% 0% 20% 16% -13% 4% 5% 10% Samsung 4,327 1,519 2,061 3,384 4,452 11,416 4,891 5,281 5,864 6,356 22,392 % YoY -15% 161% 170% 140% 183% 164% 222% 156% 73% 43% 96% % QoQ -3% 36% 64% 32% 10% 8% 11% 8% Micron 4,584 1,612 1,821 1,985 2,243 7,662 2,468 2,714 3,067 3,466 11,716 % YoY 417% 106% 60% 57% 60% 67% 53% 49% 55% 55% 53% % QoQ 15% 13% 9% 13% 10% 10% 13% 13% CXMT 53 21 26 31 44 122 53 74 111 165 403 % YoY 168% 142% 93% 139% 130% 149% 191% 264% 272% 232% % QoQ 15% 20% 20% 44% 20% 40% 50% 48% Total Supply 21,591 6,955 7,712 9,959 12,012 36,638 12,022 12,882 14,100 15,574 54,579 % YoY 69% 63% 52% 68% 90% 70% 73% 67% 42% 30% 49% % QoQ 10% 11% 29% 21% 0% 7% 9% 10% Source: Company data, UBS estimates Figure 4: Adjusted HBM supply vs demand  Source: Company data, UBS estimates Figure 5: HBM as % of total DRAM revenues  Source: UBS estimates Figure 6: HBM as % of total DRAM bits  Source: UBS estimate Figure 7: HBM ASP forecasts (US\$/1Gb)  Source: UBS estimates Figure 8: HBM bit share by vendor  Source: Company data, UBS estimates Figure 9: DRAM industry capacity (k wpm) breakdown between DDR and HBM  Source: Company data, UBS estimates Figure 10: DRAM capacity (k wpm) breakdown between DDR and HBM supplier  Source: Company data, UBS estimates Figure 11: HBM demand by type (2026E)  Source: UBS estimates Figure 12: HBM demand by type (2027E)  Source: UBS estimates Figure 13: HBM demand by customer (2026E)  Source: UBS estimates Figure 14: HBM demand by customer (2027E)  Source: UBS estimates Figure 15: DDR cycles in context  Source: Company data, UBS estimates Figure 16: NAND cycles in context  Source: Company data, UBS estimates Figure 17: DRAM bit demand per application (2026E)  Source: Gartner, UBS estimates Figure 18: DRAM bit demand per application (2027E)  Source: Gartner, UBS estimates Figure 19: NAND bit demand per application (2026E)  Source: Gartner, UBS estimates Figure 20: NAND bit demand per application (2027E)  Source: Gartner, UBS estimates Figure 21: Memory as % of flagship/premium smartphone BOM costs, 1Q22-4Q27E  Source: Counterpoint, Fomalhaut, UBS estimates Figure 22: Memory as % of mid-range/lower-end smartphones, 1Q22-4Q27E  Source: UBS estimates Figure 23: DRAM industry wafer starts and YoY growth  Source: Company data, UBS estimates Figure 24: NAND industry wafer starts and YoY growth  Source: Company data, UBS estimates Figure 25: DRAM industry bit supply and YoY growth  Source: Company data, UBS estimates Figure 26: NAND industry bit supply and YoY growth  Source: Company data, UBS estimates Figure 27: CXMT wafer capacity and as % of DRAM industry  Source: UBS estimates Figure 28: CXMT bit shipments and as % of DRAM industry  Source: UBS estimates Figure 29: UBS DRAM supply/demand summary Q125 Q225 Q325 Q425 2025 Revenues ($ mil) 26,415 31,776 39,234 52,958 150,384 % QoQ -7.3% 20.3% 23.5% 35.0% % YoY 46.4% 39.0% 54.3% 85.8% 58.6% Supply (Shipments Based) (M 1Gb) 64,317 75,938 85,576 87,400 313,229 % QoQ -2.6% 18.1% 12.7% 2.1% % YoY 3.4% 14.2% 28.9% 32.3% 19.9% Demand (End Consumption) (M 1Gb) 69,879 73,066 87,229 94,120 324,295 % QoQ 0.2% 4.6% 19.4% 7.9% % YoY 17.5% 21.0% 35.1% 34.9% 27.6% DDR Demand (M 1Gb) 306,809 % YoY 24.9% Inventory adjustment -6,150 3,250 200 -700 -3,400 Inventory Adj. Demand (M 1Gb) 63,729 76,316 87,429 93,420 320,895 % QoQ -5.8% 19.8% 14.6% 6.9% % YoY 1.6% 10.5% 28.7% 38.1% 20.0% Wafer out (k wpm, 12" equi.) 1,716 1,764 1,804 1,854 1,784 % QoQ 2.5% 2.8% 2.3% 2.8% % YoY 17.9% 16.5% 13.4% 10.8% 14.5% % Sufficiency Ratio 0.9% -0.5% -2.1% -6.4% -2.4% Blended ASP incl. HBM ($/Gb) 0.41 0.42 0.46 0.61 0.48 % QoQ -4.8% 1.9% 9.6% 32.2% % YoY 41.5% 21.8% 19.7% 40.4% 32.2% DDR ASP ($/Gb) 0.33 0.35 0.38 0.53 0.40 % QoQ -6.2% 7.0% 7.0% 42.0% % YoY 20.3% 10.6% 11.8% 52.5% 26.4% HBM ASP ($/Gb) 1.42 1.55 1.56 1.52 1.52 % QoQ 2.7% 9.4% 0.4% -2.5% % YoY 25.6% 28.3% 16.9% 10.0% 15.6% Source: Company data, UBS estimates Q126 Q226 Q326E Q426E 98,124 146,329 193,867 227,347 85.3% 49.1% 32.5% 17.3% 271.5% 360.5% 394.1% 329.3% 89,789 96,748 103,476 109,808 2.7% 7.8% 7.0% 6.1% 39.6% 27.4% 20.9% 25.6% 89,600 91,657 100,847 109,294 -4.8% 2.3% 10.0% 8.4% 28.2% 25.4% 15.6% 16.1% 17,300 13,200 6,700 4,000 106,900 104,857 107,547 113,294 14.4% -1.9% 2.6% 5.3% 67.7% 37.4% 23.0% 21.3% 1,889 1,907 1,929 1,964 1.9% 1.0% 1.2% 1.8% 10.1% 8.1% 7.0% 5.9% -16.0% -7.7% -3.8% -3.1% 1.09 1.51 1.87 2.07 80.4% 38.4% 23.9% 10.5% 166.1% 261.4% 308.6% 241.7% 1.05 1.51 1.88 2.09 97.0% 43.0% 25.0% 11.0% 220.3% 328.0% 400.0% 290.9% 1.57 1.59 1.79 1.91 3.0% 1.4% 12.7% 7.0% 10.3% 2.3% 14.8% 26.0% 2026E Q127E Q227E Q327E Q427E 2027E 665,667 258,641 288,546 316,883 337,869 1,201,939 13.8% 11.6% 9.8% 6.6% 342.6% 163.6% 97.2% 63.5% 48.6% 80.6% 399,821 114,091 121,028 128,428 133,830 497,376 3.9% 6.1% 6.1% 4.2% 27.6% 27.1% 25.1% 24.1% 21.9% 24.4% 391,398 111,919 124,474 143,094 164,161 543,648 2.…